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NCP3170BDR2G Electronic IC Chips Synchronous PWM Switching Converter

Anterwell Technology Ltd.
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    Buy cheap NCP3170BDR2G Electronic IC Chips Synchronous PWM Switching Converter from wholesalers
     
    Buy cheap NCP3170BDR2G Electronic IC Chips Synchronous PWM Switching Converter from wholesalers
    • Buy cheap NCP3170BDR2G Electronic IC Chips Synchronous PWM Switching Converter from wholesalers

    NCP3170BDR2G Electronic IC Chips Synchronous PWM Switching Converter

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    Brand Name : Anterwell
    Model Number : NCP3170BDR2G
    Certification : new & original
    Price : Negotiate
    Payment Terms : T/T, Western Union, Paypal
    Supply Ability : 9500pcs
    Delivery Time : 1 day
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    NCP3170BDR2G Electronic IC Chips Synchronous PWM Switching Converter


    NCP3170

    Synchronous PWM Switching Converter


    The NCP3170 is a flexible synchronous PWM Switching Buck Regulator. The NCP3170 operates from 4.5 V to 18 V, sourcing up to 3 A and is capable of producing output voltages as low as 0.8 V. The NCP3170 also incorporates current mode control. To reduce the number of external components, a number of features are internally set including soft start, power good detection, and switching frequency. The NCP3170 is currently available in an SOIC−8 package.


    Features

    • 4.5 V to 18 V Operating Input Voltage Range

    • 90 m High-Side, 25 m Low-Side Switch

    • FMEA Fault Tolerant During Pin Short Test

    • 3 A Continuous Output Current

    • Fixed 500 kHz and 1 MHz PWM Operation

    • Cycle-by-Cycle Current Monitoring

    • 1.5% Initial Output Accuracy

    • Internal 4.6 ms Soft-Start

    • Short-Circuit Protection

    • Turn on Into Pre-bias

    • Power Good Indication

    • Light Load Efficiency

    • Thermal Shutdown

    • These are Pb-Free Devices


    Typical Applications

    • Set Top Boxes

    • DVD/Blu−ray Drives and HDD

    • LCD Monitors and TVs

    • Cable Modems

    • PCIe Graphics Cards

    • Telecom/Networking/Datacom Equipment

    • Point of Load DC/DC Converters




    ABSOLUTE MAXIMUM RATINGS (measured vs. GND pin 3, unless otherwise noted)

    RatingSymbolVMinVMaxUnit
    Main Supply Voltage InputVIN−0.320V
    Voltage between PGND and AGNDVPAG−0.30.3V
    PWM Feedback VoltageFB−0.36V
    Error Amplifier VoltageCOMP−0.36V
    Enable VoltageEN−0.3VIN + 0.3 VV
    PG VoltagePG−0.3VIN + 0.3 VV
    VSW to AGND or PGNDVSW−0.7VIN + 0.3 VV
    VSW to AGND or PGND for 35nsVSWST−5VIN + 10 VV
    Junction Temperature (Note 1)TJ+150°C
    Operating Ambient Temperature RangeTA−40 to +85°C
    Storage Temperature RangeTstg− 55 to +150°C

    Thermal Characteristics (Note 2)

    SOIC−8 Plastic Package

    Maximum Power Dissipation @ TA = 25°C

    Thermal Resistance Junction-to-Air

    Thermal Resistance Junction-to-Case


    PD

    RθJA

    RθJC


    1.15

    87

    37.8


    W

    °C/W

    °C/W

    Lead Temperature Soldering (10 sec):

    Reflow (SMD Styles Only) Pb-Free (Note 3)

    RF260 peak°C

    Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.

    1. The maximum package power dissipation limit must not be exceeded.

    PD= [TJ(max) - TA] / RθJA

    2. The value of JA is measured with the device mounted on 2in x 2in FR−4 board with 2oz. copper, in a still air environment with TA = 25°C. The value in any given application depends on the user’s specific board design.

    3. 60−180 seconds minimum above 237°C.


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