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OPA1632DGNR IC Chips High Perfomance , Fully-Differential AUDIO OP AMP

Anterwell Technology Ltd.
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    Buy cheap OPA1632DGNR IC Chips High Perfomance , Fully-Differential AUDIO OP AMP from wholesalers
     
    Buy cheap OPA1632DGNR IC Chips High Perfomance , Fully-Differential AUDIO OP AMP from wholesalers
    • Buy cheap OPA1632DGNR IC Chips High Perfomance , Fully-Differential AUDIO OP AMP from wholesalers

    OPA1632DGNR IC Chips High Perfomance , Fully-Differential AUDIO OP AMP

    Ask Lasest Price
    Brand Name : Anterwell
    Model Number : OPA1632DGNR
    Certification : new & original
    Price : Negotiate
    Payment Terms : T/T, Western Union, Paypal
    Supply Ability : 8600pcs
    Delivery Time : 1 day
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    OPA1632DGNR IC Chips High Perfomance , Fully-Differential AUDIO OP AMP


    OPA1632

    High-Perfomance, Fully-Differential AUDIO OP AMP


    FEATURES

    • SUPERIOR SOUND QUALITY

    • ULTRA LOW DISTORTION: 0.000022%

    • LOW NOISE: 1.3nV/√Hz

    • HIGH SPEED:

    − Slew Rate: 50V/µs

    − Gain Bandwidth: 180MHz

    • FULLY DIFFERENTIAL ARCHITECTURE:

    − Balanced Input and Output Converts Single-Ended Input to Balanced Differential Output

    • WIDE SUPPLY RANGE: ±2.5V to ±16V

    • SHUTDOWN TO CONSERVE POWER


    APPLICATIONS

    • AUDIO ADC DRIVER

    • BALANCED LINE DRIVER

    • BALANCED RECEIVER

    • ACTIVE FILTER

    • PREAMPLIFIER


    DESCRIPTION

    The OPA1632 is a fully-differential amplifier designed for driving high-performance audio analog-to-digital converters (ADCs). It provides the highest audio quality, with very low noise and output drive characteristics optimized for this application. The OPA1632’s excellent gain bandwidth of 180MHz and very fast slew rate of 50V/µs produce exceptionally low distortion. Very low input noise of 1.3nV/√Hz further ensures maximum signal-to-noise ratio and dynamic range.


    The flexibility of the fully differential architecture allows for easy implementation of a single-ended to fully-differential output conversion. Differential output reduces even-order harmonics and minimizes common-mode noise interference. The OPA1632 provides excellent performance when used to drive high-performance audio ADCs such as the PCM1804. A shutdown feature also enhances the flexibility of this amplifier.


    The OPA1632 is available in an SO-8 package and a thermally-enhanced MSOP-8 PowerPAD package.


    RELATED DEVICES

    OPAx134High-Performance Audio Amplifiers
    OPA627/637Precision High-Speed DiFET Amplifiers
    OPAx227/x228Low-Noise Bipolar Amplifiers


    ABSOLUTE MAXIMUM RATINGS(1)(2)

    over operating free-air temperature range unless otherwise noted.

    Supply Voltage, ±VS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±16.5V

    Input Voltage, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±VS

    Output Current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150mA

    Differential Input Voltage, VID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±3V

    Maximum Junction Temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C

    Operating Free-Air Temperature Range . . . . . . . . . . . . . . . −40°C to +85°C

    Storage Temperature Range, TSTG . . . . . . . . . . . . . . . . . . −65°C to +150°C

    Lead Temperature 1,6mm (1/16th inch)

    from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +300°C

    ESD Ratings: Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1kV

    Charge Device Model . . . . . . . . . . . . . . . . . . . . . . . . . . . 500V

    Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200V


    (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied.

    (2) The OPA1632 MSOP-8 package version incorporates a PowerPAD on the underside of the chip. This acts as a heatsink and must be connected to a thermally dissipative plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature, which can permanently damage the device. See TI technical brief SLMA002 for more information about using the PowerPAD thermally enhanced package.


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