ADC0820

8-Bit High Speed µP Compatible A/D Converter with Track/Hold Function

General Description

By using a half-flash conversion technique, the 8-bit ADC0820 CMOS A/D offers a 1.5 µs conversion time and dissipates only 75 mW of power. The half-flash technique consists of 32 comparators, a most significant 4-bit ADC and a least significant 4-bit ADC.

The input to the ADC0820 is tracked and held by the input sampling circuitry eliminating the need for an external sample-and-hold for signals moving at less than 100 mV/µs. For ease of interface to microprocessors, the ADC0820 has been designed to appear as a memory location or I/O port without the need for external interfacing logic.

Key Specifications

• Resolution 8 Bits

• Conversion Time 2.5 µs Max (RD Mode)

1.5 µs Max (WR-RD Mode)

• Low Power 75 mW Max

• Total Unadjusted

Error ±1⁄2 LSB and ± 1 LSB

Features

• Built-in track-and-hold function

• No missing codes

• No external clocking

• Single supply — 5 VDC

• Easy interface to all microprocessors, or operates stand-alone

• Latched TRI-STATE® output

• Logic inputs and outputs meet both MOS and T2 L voltage level specifications

• Operates ratiometrically or with any reference value equal to or less than VCC

• 0V to 5V analog input voltage range with single 5V supply

• No zero or full-scale adjust required

• Overflow output available for cascading

• 0.3" standard width 20-pin DIP

• 20-pin molded chip carrier package

• 20-pin small outline package

• 20-pin shrink small outline package (SSOP)

Connection and Functional Diagrams

Absolute Maximum Ratings (Notes 1, 2)

If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications.

Supply Voltage (V_CC) 10V

Logic Control Inputs −0.2V to V_CC +0.2V

Voltage at Other Inputs and Output −0.2V to V_CC +0.2V

Storage Temperature Range −65˚C to +150˚C

Package Dissipation at T_A = 25˚C 875 mW

Input Current at Any Pin (Note 5) 1 mA

Package Input Current (Note 5) 4 mA

ESD Susceptability (Note 9) 1200V

Lead Temp. (Soldering, 10 sec.)

Dual-In-Line Package (plastic) 260˚C

Dual-In-Line Package (ceramic) 300˚C

Surface Mount Package

Vapor Phase (60 sec.) 215˚C

Infrared (15 sec.) 220˚C

Stock Offer (Hot Sell)

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