STM32F103VCT6 32 Bit MCU Linear Digital Integrated Circuits IC
Resistor
Features
■ Core: ARM 32-bit Cortex™-M3 CPU – 72 MHz maximum frequency, 1.25
DMIPS/MHz (Dhrystone 2.1) performance at 0 wait state memory access
– Single-cycle multiplication and hardware division
■ Memories – 256 to 512 Kbytes of Flash memory – up to 64 Kbytes of
SRAM – Flexible static memory controller with 4 Chip Select.
Supports Compact Flash, SRAM, PSRAM, NOR and NAND memories – LCD
parallel interface, 8080/6800 modes
■ Clock, reset and supply management – 2.0 to 3.6 V application
supply and I/Os – POR, PDR, and programmable voltage detector (PVD)
– 4-to-16 MHz crystal oscillator – Internal 8 MHz factory-trimmed
RC – Internal 40 kHz RC with calibration – 32 kHz oscillator for
RTC with calibration
■ Low power – Sleep, Stop and Standby modes – VBAT supply for RTC
and backup registers
■ 3 × 12-bit, 1 µs A/D converters (up to 21 channels) – Conversion
range: 0 to 3.6 V – Triple-sample and hold capability – Temperature
sensor
■ 2 × 12-bit D/A converters
■ DMA: 12-channel DMA controller – Supported peripherals: timers,
ADCs, DAC, SDIO, I2Ss, SPIs, I2Cs and USARTs
■ Debug mode – Serial wire debug (SWD) & JTAG interfaces –
Cortex-M3 Embedded Trace Macrocell™
■ Up to 112 fast I/O ports – 51/80/112 I/Os, all mappable on 16
external interrupt vectors and almost all 5 V-tolerant
■ Up to 11 timers – Up to four 16-bit timers, each with up to 4
IC/OC/PWM or pulse counter and quadrature (incremental) encoder
input – 2 × 16-bit motor control PWM timers with dead-time
generation and emergency stop – 2 × watchdog timers (Independent
and Window) – SysTick timer: a 24-bit downcounter – 2 × 16-bit
basic timers to drive the DAC
■ Up to 13 communication interfaces – Up to 2 × I2C interfaces
(SMBus/PMBus) – Up to 5 USARTs (ISO 7816 interface, LIN, IrDA
capability, modem control) – Up to 3 SPIs (18 Mbit/s), 2 with I2S
interface multiplexed – CAN interface (2.0B Active) – USB 2.0 full
speed interface – SDIO interface
■ CRC calculation unit, 96-bit unique ID
■ ECOPACK® packages
Table 1. Device summary
| Reference | Part number |
| STM32F103xC | STM32F103RC STM32F103VC STM32F103ZC |
| STM32F103xD | STM32F103RD STM32F103VD STM32F103ZD |
| STM32F103xE | STM32F103RE STM32F103ZE STM32F103VE |
Description
The STM32F103xC, STM32F103xD and STM32F103xE performance line
family incorporates the high-performance ARM® Cortex™-M3 32-bit
RISC core operating at a 72 MHz frequency, high-speed embedded
memories (Flash memory up to 512 Kbytes and SRAM up to 64 Kbytes),
and an extensive range of enhanced I/Os and peripherals connected
to two APB buses. All devices offer three 12-bit ADCs, four
general-purpose 16- bit timers plus two PWM timers, as well as
standard and advanced communication interfaces: up to two I2Cs,
three SPIs, two I2Ss, one SDIO, five USARTs, an USB and a CAN.
The STM32F103xx high-density performance line family operates in
the –40 to +105 °C temperature range, from a 2.0 to 3.6 V power
supply. A comprehensive set of power-saving mode allows the design
of low-power applications.
The STM32F103xx high-density performance line family offers devices
in six different package types: from 64 pins to 144 pins. Depending
on the device chosen, different sets of peripherals are included,
the description below gives an overview of the complete range of
peripherals proposed in this family
Typical current consumption in Run mode versus frequency (at 3.6 V)
- code with data processing running from RAM, peripherals enabled
